| 序号 | 说明 | 制程能力 |
| 1 | 层数 | 2~12 |
| 2 | 线宽/线距 | Min 3/3 mil (0.075/0.075mm) |
| 3 | BGA Pitch | Min 0.5mm(20mil) |
| 4 | 成品孔径 | Min 0.15mm (6mil) |
| 5 | 成品铜厚 | Max: Inner:4oz,Outer:4oz |
| 6 | 成品板厚 | 0.3mm~3.6mm(12~142mils) |
| 7 | 成品尺寸 | 80mm≤d ≤600mm |
| 8 | 孔径公差 | Min: NPTH ±0.05mm (±2mil),PTH±0.05mm (±2mil) |
| 9 | 阻抗公差 | Min: ±8% |
| 10 | 纵横比 | Max: 10:1 |
| 11 | 板弯板翘 | Min: ≤0.5% |
| 12 | 表面处理 | OSP, ENIG, HASL, Immersion Tin, Immersion Silver, Gold Plating |
| * 表面处理为喷锡公差管控±0.075mm (±3mil) | ||

汽车板品质控管体系
